Product portfolio

The wide range of ion beam and plasma processing equipment is flexible and modular in design, from small single wafer versions up to cassette load-lock solutions. Several vacuum process chambers can be combined into Cluster or Inline solutions, according to customer specific requirements.

scia Mill 150

for etching of substrates
up to 150 mm

scia Mill 200

for etching of wafers
up to 200 mm

scia Trim 200

for focused trimming of wafers
up to 200 mm

scia Coat 200

for deposition on wafers
up to 200 mm

scia Coat 500

for deposition of optical substrates
up to 500 mm x 300 mm

scia Batch 350

for PECVD coating of
3D-substrates

scia Cube 300/750

for large area PECVD and
RIE processing

scia Magna 200

for Magnetron Sputtering of
up to 200 mm

scia Multi 680

for Multilayer Deposition
on optical substrates

scia Clean 1500

for thermal desorption, vacuum desorption and plasma treatment

Tailor Made Solutions

for your needs, in different configurations