Expertise in Thin Film Technology

scia Systems provides precise surface processing equipment based on advanced ion beam and plasma technologies. The systems are applicable for coating, etching, and cleaning processes, especially for the MEMS, microelectronics, and precision optics industries. The process equipment is flexible and modular in design, thus can be easily configured for research applications and for high-volume production. It suits silicon wafer-based substrate sizes, smaller samples on carriers, and optical substrates with up to 3 m diameter.





scia Systems is going virtual for IEEE IFCS-ISAF 2020

The IEEE IFCS-ISAF 2020 Conference took place virtually this year. Although we couldn't join in person, we are still proud to support this event as Gold Patron and contribute a video of our technology.

In this pitch our sales director shows you, how to improve your manufacturing yield with our latest ion beam trimming technology of piezoelectric materials. He presents process results for the outstanding correction of critical film thickness of AlN and POI (lithium tantalate) for frequency filters.