Expertise in Thin Film Technology

scia Systems provides precise surface processing equipment based on advanced ion beam and plasma technologies. The systems are applicable for coating, etching, and cleaning processes, especially for the MEMS, microelectronics, and precision optics industries. The process equipment is flexible and modular in design, thus can be easily configured for research applications and for high-volume production. It suits silicon wafer-based substrate sizes, smaller samples on carriers, and optical substrates with up to 3 m diameter.


Our systems are flexible and modular in design. This enables us to offer standard as well as individual solutions for our customers.


Our equipment is mainly used in the production of MEMS and precision optical components, but also in astronomy and biomedical technology.


Pushing the latest technologies with ambition and constantly evolving - that's what scia Systems is all about. 

scia Systems obtains an order for a scia Etch 300 by Ernst-Abbe-University Jena

The Ernst Abbe University of Applied Sciences Jena, which is the largest and most research-intensive university of applied sciences in Thuringia, has recently acquired a scia Etch 300 system. The system is capable of producing advanced optical surfaces with anti-reflective nanostructures using a unique reactive ion etching (RIE) process. It handles flat substrates with a diameter of up to 300 mm as well as highly curved, voluminous, three-dimensional objects such as lenses, mirrors and prisms.

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CS International

2024-04-16 to 2024-04-17
Brussels, Belgium
Presentation at April 16: Cutting-edge SiC Manufacturing: Beyond Chemical-Mechanical Constraints by Philipp Böttger (Details)

Photomask Japan

2024-04-16 to 2024-04-18
Yokohama, Japan
Partner on site: Canon Marketing

MRS Spring Meeting

2024-04-22 to 2024-04-26
Seattle, USA
Booth: 225
Partner on site: AARD Technology


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