Expertise in Thin Film Technology

scia Systems provides precise surface processing equipment based on advanced ion beam and plasma technologies. The systems are applicable for coating, etching, and cleaning processes, especially for the MEMS, microelectronics, and precision optics industries. The process equipment is flexible and modular in design, thus can be easily configured for research applications and for high-volume production. It suits silicon wafer-based substrate sizes, smaller samples on carriers, and optical substrates with up to 3 m diameter.

Products

Discover our equipment for coating, etching and cleaning processes. The systems are flexible and modular in design. This enables us to offer standard as well as individual solutions for our customers all over the world.

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Applications

Our equipment is mainly used in the production of microelectronics, MEMS and precision optical components. However, there are also several applications in the field of astronomy, automotive and biomedical technology.

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Company

scia Systems stands for highly reliable equipment to meet expectations for today and the future. Our experienced and qualified team assists you to find the optimal system and process design for your production requirement.

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Career

Do you want to play an active role in a high-tech and fast-growing market environment and build up a successful career? We are always looking for new team members who want to grow with us.

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News

NEW APPLICATION NOTE: Ion Beam Etching for Reverse Engineering

As modern chip design pushes for smaller, more powerful and more compact devices, reverse engineering requires delayering with highest accuracy within the µm-, nm and atomic thickness range for different materials at once. Ion beam etching is capable to meet these strict requirements.

Learn more in our new application note.

 

Reverse Engineering

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