Expertise in Thin Film Technology

scia Systems provides precise surface processing equipment based on advanced ion beam and plasma technologies. The systems are applicable for coating, etching, and cleaning processes, especially for the MEMS, microelectronics, and precision optics industries. The process equipment is flexible and modular in design, thus can be easily configured for research applications and for high-volume production. It suits silicon wafer-based substrate sizes, smaller samples on carriers, and optical substrates with up to 3 m diameter.


Our systems are flexible and modular in design. This enables us to offer standard as well as individual solutions for our customers.


Our equipment is mainly used in the production of MEMS and precision optical components, but also in astronomy and biomedical technology.


Pushing the latest technologies with ambition and constantly evolving - that's what scia Systems is all about. 

Ion Beam Technology for Wafer Works

We are pleased to announce that Wafer Works and scia Systems formed a partnership to achieve further production efficiency and ensure consistently high product quality.

Being one of the world's top ten suppliers of semiconductor wafer materials, Wafer Works is specialized in polished silicon wafer amongst others. As part of this collaboration, the Taiwan-based company will receive an ion beam processing system from scia Systems.

SPIE Optifab

2023-10-16 to 2023-10-18
Rochester, USA
Booth: 710 (Floorplan)
Partner on site: AARD Technology

MST 2023

2023-10-23 to 2023-10-23
in Dresden, Germany
Booth: 19 (Floorplan


2023-11-14 to 2023-11-17
in Munich, Germany
Booth: B2.461 (Floorplan)


* mandatory field