Expertise in Thin Film Technology

scia Systems provides precise surface processing equipment based on advanced ion beam and plasma technologies. The systems are applicable for coating, etching, and cleaning processes, especially for the MEMS, microelectronics, and precision optics industries. The process equipment is flexible and modular in design, thus can be easily configured for research applications and for high-volume production. It suits silicon wafer-based substrate sizes, smaller samples on carriers, and optical substrates with up to 3 m diameter.


Our systems are flexible and modular in design. This enables us to offer standard as well as individual solutions for our customers.


Our equipment is mainly used in the production of MEMS and precision optical components, but also in astronomy and biomedical technology.


Pushing the latest technologies with ambition and constantly evolving - that's what scia Systems is all about. 

scia Systems highlights advances in ion beam processing fueling semiconductor mega market trends at SEMICON West 2024

scia Systems will present its key advances in ion beam processing for semiconductor, sensor, and photonic integrated circuit (PIC) manufacturing at SEMICON West 2024, which will take place from July 9 to 11, 2024, at the Moscone Center in San Francisco, USA. scia Systems’ high-precision solutions are essential in enabling many of today’s high-growth consumer and industrial applications. The applications include manufacturing three-dimensional optoelectronic microstructures for PICs, such as waveguides, production of GMR/TMR sensors, and precision reverse engineering of ICs.

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Semicon WEST

2024-07-09 to 2024-07-11
San Francisco, USA
Booth: 553


2024-08-18 to 2024-08-22
San Diego, USA
Booth: 829 (Floorplan)
Partner on site: AARD Technology


Tokyo, Japan
Presentation by Manabu Yamazaki about Ion Beam Trimming with scia Trim 200


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