Improved silicon wafer processing for ESA’s X-ray observatory "Athena"
Expertise in Thin Film Technology
scia Systems provides precise surface processing equipment based on advanced ion beam and plasma technologies. The systems are applicable for coating, etching, and cleaning processes, especially for the MEMS, microelectronics, and precision optics industries. The process equipment is flexible and modular in design, thus can be easily configured for research applications and for high-volume production. It suits silicon wafer-based substrate sizes, smaller samples on carriers, and optical substrates with up to 3 m diameter.
Products
Our systems are flexible and modular in design. This enables us to offer standard as well as individual solutions for our customers all over the world.
Career
Do you want to play an active role in a high-tech and fast-growing market environment and build up a successful career? Discover our oppotunities:
Applications
Our equipment is mainly used in the production of MEMS and precision optical components, but it is also used in astronomy, automotive and biomedical technology.
Company
scia Systems stands for highly reliable equipment to meet expectations for today and the future. Our experienced and qualified team assists you to find the optimal system and process design for your production requirement.
