Expertise in Thin Film Technology

scia Systems provides precise surface processing equipment based on advanced ion beam and plasma technologies. The systems are applicable for coating, etching, and cleaning processes, especially for the MEMS, microelectronics, and precision optics industries. The process equipment is flexible and modular in design, thus can be easily configured for research applications and for high-volume production. It suits silicon wafer-based substrate sizes, smaller samples on carriers, and optical substrates with up to 3 m diameter.

Products

Our systems are flexible and modular in design. This enables us to offer standard as well as individual solutions for our customers.

Applications

Our equipment is mainly used in the production of MEMS and precision optical components, but also in astronomy and biomedical technology.

Company

Pushing the latest technologies with ambition and constantly evolving - that's what scia Systems is all about. 

North Carolina State University Orders Ion Beam Etching Equipment from scia Systems

The NCSU has purchased a scia Mill 200 system, which will be used to process wide bandgap semiconductor materials such as SiC and GaN to enable power electronic devices that operate at much higher voltages, frequencies, and temperatures and more efficiently.

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scia Mill 200

Semicon Japan

2024-12-11 to 2024-12-13
Tokyo, Japan
Booth: 6046
Partner on site: Hightec Systems
 

IEEE MEMS

2025-01-19 to 2025-01-23
Kaohsiung, Taiwan
Booth: 13 (Floorplan)
Partner on site: AARD Technology & WESi Technology

SPIE AR | VR | MR

2025-01-28 to 2025-01-29
San Francisco, USA
Booth: 6410 (Floorplan)
Partner on site: AARD Technology
 

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