Expertise in Thin Film Technology

scia Systems provides precise surface processing equipment based on advanced ion beam and plasma technologies. The systems are applicable for coating, etching, and cleaning processes, especially for the MEMS, microelectronics, and precision optics industries. The process equipment is flexible and modular in design, thus can be easily configured for research applications and for high-volume production. It suits silicon wafer-based substrate sizes, smaller samples on carriers, and optical substrates with up to 3 m diameter.

Products

Our systems are flexible and modular in design. This enables us to offer standard as well as individual solutions for our customers.

Applications

Our equipment is mainly used in the production of MEMS and precision optical components, but also in astronomy and biomedical technology.

Company

Pushing the latest technologies with ambition and constantly evolving - that's what scia Systems is all about. 

Yongjiang Laboratory Orders Reactive Ion Beam Trimming Equipment from scia Systems

Yongjiang Laboratory (Y-LAB), a non-profit research and innovation center in Zhejiang province, China, has purchased a scia Trim 200. This system provides precise surface correction in film and wafer materials using ion beam trimming. The film thickness uniformity can be adjusted up to 0.1 nm.

Read more
scia Trim 200 with Y-LAB Logo

CIOE

2024-09-11 to 2024-09-13
Shenzhen, China
Booth: 3A41 (Thuringian pavilion)
 

MNE 2024

2024-09-16 to 2024-09-19
Montpellier, France
Oral Track by Matthias Nestler: High Throughput Magnetron Sputtering of Tilted c-Axis AlN Films for Biosensing Applications

Joint Vacuum Conference

2024-09-30 to 2024-10-04
Split, Croatia

 

Contact

* mandatory field