Expertise in Thin Film Technology

scia Systems provides precise surface processing equipment based on advanced ion beam and plasma technologies. The systems are applicable for coating, etching, and cleaning processes, especially for the MEMS, microelectronics, and precision optics industries. The process equipment is flexible and modular in design, thus can be easily configured for research applications and for high-volume production. It suits silicon wafer-based substrate sizes, smaller samples on carriers, and optical substrates with up to 3 m diameter.

Products

Our systems are flexible and modular in design. This enables us to offer standard as well as individual solutions for our customers.

Applications

Our equipment is mainly used in the production of MEMS and precision optical components, but also in astronomy and biomedical technology.

Company

Pushing the latest technologies with ambition and constantly evolving - that's what scia Systems is all about.

Latest News

Chemnitz, July 17, 2025 — Innovations in PICs are fundamental to the advancement of quantum technology and have the potential to change our increasingly data-driven world immensely. Megatrends such as the Internet of Things (IoT), 5G, and cloud computing are driving the exponential growth in data traffic. Innovative solutions that improve bandwidth, efficiency, and speed are, therefore, in demand. PICs are becoming increasingly important as they offer the ability to process and transmit data at optical speed while significantly reducing energy consumption compared to conventional electronic circuits.

One key processing technology for the production of PICs is ion beam etching. It enables the production of three-dimensional optoelectronic microstructures for PICs, such as waveguides and other optical components, with accuracies in the nanometer range.

Unlike electronic integrated circuits, PICs use photons (light particles) for data transmission and processing, paving the way for faster and more efficient technologies. However, the mass production of high-performance PICs remains challenging. One key factor? Material uniformity.

Our latest application note shows how ion beam trimming with scia Systems’ advanced solutions can reduce thickness standard deviation in silicon nitride films by a factor of ~16, paving the way for scalable, precise PIC manufacturing.

Want to learn more? Read the complete Application Note for free.