Application Notes
The equipment of scia Systems is mainly used in the production of microelectronics and MEMS devices as well as for processing of precision optical components, but there are also applications in the biomedical sector. In the following, selected applications are presented in detail.
MEMS
Failure Analysis and Material Inspection
of IC chip devices
Frequency Trimming
of bulk acoustic wave (BAW) filters
Surface Trimming
of surface acoustic wave (SAW) filters
Thickness Trimming
of POI wafers for RF filters (SAW)
Film Thickness Correction
of thin film read/write heads (TFH)
Temperature Compensation
for surface acoustic wave wafers (TC-SAW)
Optics
Patterning of Lithium Niobate
via Ion Beam Etching for Photonic Integrated Circuits (PICs)
Ion Beam Thickness Trimming
for Photonic Integrated Circuit Wafers
Etching of Surface Relief Gratings
for Augmented & Mixed-Reality-Devices
Dielectric Coatings
on large substrates
High- and Anti-Reflective Coatings
with Ta2O5 and SiO2
Form Error Correction
for X-ray mirrors
Deposition of DLC
for glass compression molds
Sensors
Deposition of GMR Sensors
for flexible magnetoelectronics
Etching of Magnetic Multilayers
for tunnel-magneto-resistance (TMR) sensors
Etching of Lithium Tantalate
for infrared (IR) sensors
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Learning
Overview of PVD Technologies
Comparison of ion beam sputtering, magnetron sputtering and evaporation.
Ion beam etching for optics structuring
Video presentation: How to structure your optics with reactive ion beam etching.
Ion beam trimming of POI wafers
Video presentation: Surface correction of piezoelectric materials
Ion beam figuring for telescope mirrors
Video presentation: surface error correction in high vacuum
Magnetron Sputtering of SiO2
Advantages of magnetron sputtering for silicon dioxide deposition.
