Ion beam trimming is a special ion beam milling process, where a focused ion beam scans across the wafer. The local material removal is controlled by adjusting the dwell time. In his video presentation, our sales director Marcel Demmler introduces the ion beam trimming process and our process solution scia Trim 200, which can significantly improve the manufacturing yield of piezoelectric devices. He follows up by showing you two application examples including process results.
Here you can see the presentation.
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