Video presentation: Ion beam trimming of piezoelectric materials
Ion beam trimming is a special ion beam milling process, where a focused ion beam scans across the wafer. The local material removal is controlled by adjusting the dwell time. In his video presentation, our sales director Marcel Demmler introduces the ion beam trimming process and our process solution scia Trim 200, which can significantly improve the manufacturing yield of piezoelectric devices. He follows up by showing you two application examples including process results.
Here you can see the presentation.
Technology
Learn more about ion beam trimming and other ion beam processes in our technology overview.
Application
In our Application Note, we show you how ion beam trimming improves the surface homogeneity of POI wafers for RF filters.
Product
The scia Trim 200 is used for high precision surface trimming of wafers up to 200 mm, without limitations in film and wafer materials.
Do you want to speak to one of our experts? Contact us:
scia Systems GmbH
Clemens-Winkler-Str. 6c
09116 Chemnitz
Germany
Tel: +49 371 33561-0