Video presentation: Ion beam trimming of piezoelectric materials

Ion beam trimming is a special ion beam milling process, where a focused ion beam scans across the wafer. The local material removal is controlled by adjusting the dwell time. In his video presentation, our sales director Marcel Demmler introduces the ion beam trimming process and our process solution scia Trim 200, which can significantly improve the manufacturing yield of piezoelectric devices. He follows up by showing you two application examples including process results.

Here you can see the presentation.   

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Learn more about ion beam trimming and other ion beam processes in our technology overview.



In our Application Note, we show you how ion beam trimming improves the surface homogeneity of POI wafers for RF filters.



The scia Trim 200 is used for high precision surface trimming of wafers up to 200 mm, without limitations in film and wafer materials.


Do you want to speak to one of our experts? Contact us:


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scia Systems GmbH
Clemens-Winkler-Str. 6c
09116 Chemnitz

Tel: +49 371 33561-0


Additional Information

Overview of PVD Technologies

Comparison of ion beam sputtering, magnetron sputtering and evaporation.

Ion beam for piezoelectrics

Video presentation: Benefits of ion beam technology for piezoelectric films

Slanted gratings by ion beam trimming

Video presentation: Processing with varying slant angles by reactive IBT