The scia Cluster 200 is a modular platform for coating, etching, and cleaning processes based on advanced ion beam and plasma technologies. A cluster uses multiple identical process chambers to achieve a significant throughput increase, or integrates different process technologies for sequential process steps on a single wafer without a vacuum break.
The scia Cluster 200 system can be configured individually for each customer's application, allowing up to five process chambers and one or two load locks to be installed around the central transfer chamber.
Modular platform with multiple processes in one system or several identical process chambers
Highest flexibility, choosing from an extensive technology portfolio for deeply customized solutions
Scalable platform with individual chamber quantity for increased throughput and efficient production
Less contamination and reduced total cycle time by continuous process chain without vacuum interruption
Lower total cost of ownership with smaller footprint and less utility consumption
Easy-to-use software for centralized recipe-based cross-chamber processing, boosting efficiency and flexibility
Dense, uniform, and defectfree coating of metals, dielectric materials and multilayers
Precise and efficient deposition of piezoelectric layers, electrode materials and electrical insulation
Ultra-pure coatings from up to 12 evaporation materials for glancing angle deposition (GLAD) and metallization
Structuring, patterning, delayering and smoothing of any material, also for reactive etching (RIBE/CAIBE)
Localized frequency and film thickness trimming for dimensional correction with Ånstrom precision
Conformal low temperature coating of nitrides, carbides, standard oxides, metal seeds and dielectrics
Plasma-assisted reactive process for deposition of encapsulation layers
Physically and chemically etching process to improve surface quality
