Glancing Angle Deposition for Precise Nanostructures

With the scia Eva 200 ultra-pure coatings can be deposited on up to 200 mm wafers by electron beam (e-beam) evaporation. The system enables up to 12 target materials in crucible-pockets and can be configured with single wafer load lock or with fully automated cassette handling. In addition, the system has a very small footprint and an ion beam source can be integrated for pre-cleaning.

Features & Benefits

  • Substrate holder precisely tiltable and rotatable, defined angle of incidence adjustable
  • High deposition rates for evaporation of high temperature materials and refractory metals
  • Up to 12 evaporation materials in water-cooled multi pocket rotatable crucible
  • Optional ion beam source for pre-cleaning
  • Fully automatic cassette handling in variable cluster layouts including SECS/GEM communication


  • Glancing angle deposition (GLAD) of nano-structured thin film layers for production of photo-electrodes for efficient fuel generation
  • Infrared-emitters for detection and spectroscopy for gas analyzer and smart applications
  • Metallization of substrates
  • Dielectric coatings
  • Optical coatings


  • Electron Beam (E-beam) Evaporation

    Current through tungsten filament causes electron emission, which accelerates to an e-beam by high voltage. A magnetic field deflects the e-beam so that it is focused into the crucible. This leads to evaporation of target material and deposition on the substrate.

Detailled Information

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Product Flyer scia Eva 200


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