Large Area Coating and Etching over 300 mm x 200 mm

The scia Cube 300 is designed for large area high-density plasma processes. The system enables deposition with high rates and a wide range of deposition parameters. In addition, etching processes with oxygen or halogen chemistry for high anisotropic etching and/or optimized selectivity are possible.

Features & Benefits

  • Large area processing with an array of synchronized linear microwave sources
  • Independent RF bias at substrate holder for energetic substrate bombardment
  • Substrate cooling (-10 °C) or heating (850 °C)
  • In-situ chamber cleaning process


  • PECVD Processes
    • Deposition of dielectric films, e.g. encapsulation, barrier coatings, electric insulation (SiO2, Si3N4, …)
    • Optical and scratch resistant coatings (a-C:H, DLC)
    • Growing of nano-crystalline diamond and carbon nanotubes
  • RIE Processes
    • Reactive etching and structuring of metals (Ni, Cr, Pt, …)
    • Etching of gratings and other structures in optical materials (quartz, fused silica)
    • Ashing of photoresist

Application Note


  • Plasma of reactive gases is created by microwave sources
  • Enhanced ion bombardment with RF bias


Plasma Enhanced Chemical Vapor Deposition (PECVD) is a plasma assisted reactive process to deposit thin films from a gas state (vapor) into a solid state on a substrate.

Reactive Ion Etching (RIE) uses reactive gases and ion bombardment for physically and chemically etching of the substrate surface.

Technical Data

Substrate size (up to)

300 mm x 200 mm

Substrate holder

Water-cooled, RF bias

Substrate temperature

Alternatively cryo-cooling down to -10 °C or heating up to 850 °C

Plasma sources

2 linear microwave sources (PL400) and/or
RF parallel plate arrangement, 13.56 MHz

Typical deposition rates

Diamond: 30 … 70 nm/h, DLC: 7.5 nm/min

Power supply

MW power: max. 9 kW, RF power: max. 0.6 kW

Base pressure

< 1 x 10-6 mbar

System dimension (W x D x H)

1.30 m x 1.90 m x 1.50 m (without electrical rack and pumps)


Single chamber, optional single substrate load lock

Software interfaces


PDF Download

Product Flyer scia Cube 300


Reach out

Please contact us for further information.


More PECVD/RIE Systems

scia Batch 350

for 3D - coatings in batches

scia Cube 750

for large area coating and etching
over 750 mm x 750 mm