High-Quality Cleaning and Qualification up to 800 mm in dia. and 500 mm in height

The scia Clean 800 is used for dry-cleaning of 3-dimensional shaped substrates with weights up to 500 kg. The chamber design and functionality ensures a very good base pressure and allows to quantify even small residual contaminations on the substrate by mass spectroscopy measurement.

Features & Benefits

Low base pressure and fast pumping due to electropolished and heated vacuum chamber
Separate substrate heating for improved desorption
Qualification of residual contamination by high-sensitive mass spectroscopy
Optional plasma source for advanced cleaning with H₂ plasma
Recipes for repeatable temperature ramps and fully automated cleaning cycles
Crane for loading of large and heavy substrates

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Applications

Ultra-high purity cleaning of X-ray optics
Cleaning of components for beam line accelerators
Outgassing qualification of complex vacuum assemblies

Principle

Removing of contaminations from 3-dimensional shaped substrates by using ultra-high vacuum (vacuum desorption)
Further cleaning progress with optional heating of substrate and/or chamber (thermal desorption) and applying plasma treatment

Technologies

Dry-Cleaning allows the removal of substrate surface contaminations in vacuum with different methods. These methods can be applied successively to optimize the cleaning results.

Technical Data

Substrate size (up to)	800 mm dia., 500 mm height, 500 kg
Substrate heating	Radiation heaters (4.5 kW) up to 250 °C
Chamber heating and cooling	Pressurized water based heating up to 150 °C and cooling (8 kW)
Plasma sources	Optional ICP plasma source (PI400), max. 2.5 kW
Base pressure	< 5 x 10^-9 mbar
Quality control	Mass spectrometer for quantitative outgassing measurement
System dimension (W x D x H)	1.30 m x 2.50 m x 1.40 m (without electrical rack and pumps)
Configuration	Single chamber with top lid, optional crane for loading of heavy substrates
Software interfaces	SECS II / GEM, OPC