| scia Multi 300 Wafer | scia Multi 300 Optics | |
| Loading / Substrate Dimension | Wafer handling up to 300 mm wafer, max. 0.5 kg | Carrier handling of mirrors up to 300 mm, 80 mm high, 30 kg |
Sputter source | 4 rectangular magnetrons (381 mm x 89 mm) | 6 rectangular magnetrons (381 mm x 89 mm) |
Sputter modes | DC in CW or pulsed mode (1 kW) and/or RF (1 kW, 13.56 MHz) | DC in CW or pulsed mode (1 kW) and/or RF (1 kW, 13.56 MHz) |
Base pressure | < 8 x 10-8 mbar | < 8 x 10-8 mbar |
System dimension | 3.60 m x 2.70 m x 2.30 m (without electrical rack and pumps) | 3.60 m x 2.70 m x 2.30 m (without electrical rack and pumps) |
Software interface | SECS II / GEM, OPC | SECS II / GEM, OPC |
Multilayers on 300 mm Substrates
The scia Multi 300 has been developed in two versions: the scia Multi 300 Wafer for wafer coatings and the scia Multi 300 Optics for coating optical assemblies by magnetron sputtering.
scia Multi 300 Wafer: The system can be equipped with up to four magnetrons, enabling high-precision multilayer stacks of up to four target materials without breaking the vacuum. Through the configuration of the gas system and the generators, the system is designed for the deposition of metal or conductive layers. A cassette load lock with automatic substrate transfer and the system control ensure a fully automatic and recipe-controlled process.
scia Multi 300 Optics: The system can be equipped with up to six magnetrons, enabling high-precision multilayer stacks of up to six target materials without breaking the vacuum. Through the configuration of the gas system and the generators, the system is designed to deposit metal or conductive layers. The system is equipped with a single load lock for holders for optical assemblies (carriers). Large-volume and heavy optical components can be individually adapted to the holder.
Features & Benefits
- Excellent uniformity over 300 mm substrate area
- Synchronized orbital and spin rotation for uniform multilayer films on wafers
- Up to 6 magnetrons (for optics application)
- Up to 4 magnetrons (for wafer application), each with shutter unit
- Carrier based sample processing
- Sample face-down orientation
Applications
Application Example: Manufacturing of GMR sensors by HZDR on scia Multi 300 Wafer: Samples prepared on different substrate materials lead to the same sensor performance.
Left Picture: View of sensor under an angle with electron microscopy | Right: Comparison of several magneto-resistance curves on different substrate types
- TMR and GMR multilayers on flat substrates on scia Multi 300 Wafer
- Soft X-ray and EUV gradient multilayers for mirrors on scia Multi 300 Optics
Application Note
Principle
- Circular substrate movement across magnetrons, each orbital rotation completes one period of the stack
- Compensation of individual emission profiles of the magnetrons by precalculating the orbital rotation profiles
Technologies
Magnetron Sputtering utilizes plasma ion bombardment on a target to deposit thin films on the substrate surface.
Detailled Information
Technical Data
Process Results
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scia Multi 300 Wafer / Optics
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Product Overview
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More Magnetron Sputtering Systems
scia Magna 200
for advanced wafer coatings
of up to 200 mm
scia Multi 680
for multilayer coating of large
substrates up to 680 mm
