Multilayer Coatings for Optical Substrates

The scia Magna series includes advanced magnetron sputtering systems designed for high-precision multilayer coatings on optical substrates, achieving (sub-)nanometer accuracy. Each system can be equipped with up to six magnetrons, allowing the deposition of complex multilayer stacks from different target materials without the need to break vacuum.

Equipped with automated substrate handling, the scia Magna 400 Inline, scia Magna 500 Inline, scia Magna 700 Inline and scia Magna 1200 Inline enable fully automated, recipe-driven processing. Precise, position-controlled substrate motion enables defined gradient layers and superior deposition uniformity.

Features & Benefits

Multilayer coating with inline arrangement of multiple process sources
Uniform or gradient films on optical substrates by synchronized linear movement and spin rotation
6 linear magnetron sputter sources
Optional surface treatment by ion source
Vertical substrate orientation for minimized particle load

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Applications

Alternating stack of (Si/Mo)₂₃ for Bragg mirror. The results show very reproducible thicknesses of each period.

Gradient multilayer coatings of mirrors for EUV
Multilayer stacks for X-ray mirrors for beam line and analytic applications

Principle

Inline arrangement with 6 magnetron sputter sources
Linear substrate movement past magnetrons and superimposed substrate rotation

Technologies

Magnetron Sputtering utilizes plasma ion bombardment on a target to deposit thin films on the substrate surface.

Detailled Information

scia Magna 400 Inline

Substrate size (up to)	400 mm x 300 mm, 300 mm dia. for spin rotation
Sputter source	6 rectangular magnetrons (305 mm x 89 mm), ion source possible
Sputter modes	DC in CW or pulsed mode (1.5 or 3 kW) and/or RF (1.5 or 3 kW, 13.56 MHz)
Typical deposition rates (dynamic)	Mo: 50 nm·mm/s, Si: 35 nm·mm/s
Uniformity variation	< 1 % (σ/mean) over 300 mm dia.
Base pressure	< 5 x 10^-8 mbar
System dimension (W x D x H)	8.1 m x 1.4 m x 2.80 m (without electrical rack and pumps)
Configuration	Inline system with load lock and loading station at both ends possible
Software interface	SECS II / GEM, OPC

scia Magna 500 Inline

Substrate size (up to)	500 mm x 300 mm, 300 mm dia. for spin rotation
Sputter source	6 rectangular magnetrons (305mm x 89 mm), ion source possible
Sputter modes	DC in CW or pulsed mode (1.5 or 3 kW) and/or RF (1.5 or 3 kW, 13.56 MHz)
Typical deposition rates (dynamic)	Mo: 50 nm·mm/s, Si: 35 nm·mm/s
Uniformity variation	< 1 % (σ/mean) over 300 mm dia.
Base pressure	< 5 x 10^-8 mbar
System dimension (W x D x H)	8.10 m x 1.40 m x 2.80 m (without electrical rack and pumps)
Configuration	Inline system with load lock and loading station at both ends possible
Software interface	SECS II / GEM, OPC

scia Magna 700 Inline

Substrate size (up to)	700 mm x 450 mm, 450 mm dia. for spin rotation
Sputter source	6 rectangular magnetrons (609 mm x 89 mm), ion source possible
Sputter modes	DC in CW or pulsed mode (up to 3 kW) and/or RF (up to 3 kW, 13.56 MHz)
Typical deposition rates (dynamic)	Mo: 50 nm·mm/s, Si: 35 nm·mm/s
Uniformity variation	< 1 % (σ/mean) over 300 mm dia.
Base pressure	< 5 x 10^-8 mbar
System dimension (W x D x H)	9.10 m x 2.50 m x 2.80 m (without electrical rack and pumps)
Configuration	Inline system with load lock and loading station at both ends possible
Software interface	SECS II / GEM, OPC

scia Magna 1200 Inline

Substrate size (up to)	1200 ... 1600 mm x 350 mm, 350 mm dia. for spin rotation
Sputter source	6 rectangular magnetrons (508 mm x 89 mm), ion source possible
Sputter modes	DC in CW or pulsed mode (up to 2 kW) and/or RF (up to 2 kW, 13.56 MHz)
Typical deposition rates (dynamic)	Mo: 50 nm·mm/s, Si: 35 nm·mm/s
Uniformity variation	< 1 % (σ/mean) over 300 mm dia.
Base pressure	< 5 x 10^-8 mbar
System dimension (W x D x H)	10.30 m x 2.50 m x 2.80 m (without electrical rack and pumps)
Configuration	Inline system with load lock and loading station at both ends possible
Software interface	SECS II / GEM, OPC