Precise Surface Correction by Ion Beam Trimming

The scia Trim 300 is a high-volume production system for ion beam trimming of 300 mm wafers without material restrictions. The precise local surface correction of the substrate is performed by a focused broad ion beam with a sufficient small focal point. Controlling the local material removal results in the etching of inhomogeneities up to an impressively uniform film, thus significantly increasing the yield of usable components.

Features & Benefits

  • Significant yield improvement
  • Film thickness uniformity to be adjusted down to atom level of 0.1 nm
  • No edge exclusion with electrostatic chuck
  • Sub-nanometer removal with zero base etch function
  • Processing of film and wafer materials without restrictions
  • Throughput and maintenance optimized design for low production costs
  • Processing of wafers with photoresist masks due to good wafer cooling


Results IBT

  • Frequency trimming of bulk acoustic wave (BAW) or surface acoustic wave (SAW) filters
  • Thickness trimming of silicon on insulator (SOI), 
  • Dimensional correction of MEMS structures

Application Notes

  • BAW filters as high frequency filters in mobile communication
  • SAW-filters for the suppression of frequencies in mobile communications


  • Focused broad ion beam scans across wafer surface in vertical setup for low contamination
  • Local material removal is controlled by adjusting the dwell time


Ion Beam Trimming (IBT) is where a focused broad ion beam scans across the wafer and the local material removal is controlled by adjusting the dwell time.

Reactive Ion Beam Trimming (RIBT) introduces reactive gas into the ion beam source for reactive structuring of the surface.

Ion Beam Figuring (IBF) is a polishing error correction by a scanning ion beam and dwell time control.

Detailed Information

Technical Data
Process Results

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Product Flyer scia Trim 300


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Product Overview

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Other Ion Beam Etching Systems

scia Trim 200

for precise surface correction
of wafers up to 200 mm

scia Finish 1500

for polishing error correction on
substrates up to 1500 mm

scia Mill 300

for full surface etching of wafers up to 300 mm