Expertise in electronic manufacturing: Coating | Etching | Cleaning
scia Systems provides technologies and process equipment for various microelectronic applications:
Smart sensor technology
e.g., biotechnology sensors, lab-on-chip systems, GMR, TMR, IR sensors
High-frequency electronics
e.g., BAW, SAW
Cost-efficient power electronics
Advanced Silicon & beyond
System Integration by Advanced Electronics Packaging
e.g., multichip packages, SiPs, 3D packaging
MEMS Application Notes
Reverse Engineering of IC chip devices
Frequency Trimming of bulk acoustic wave (BAW) filters
Surface Trimming of surface acoustic wave (SAW) filters
Thickness Trimming of POI wafers for RF filters (SAW)
Film Thickness Correction of thin film read/write heads (TFH)
Temperature Compensation for surface acoustic wave wafers (TC-SAW
SENSOR Application Notes
Deposition of GMR Sensors for flexible magnetoelectronics
Etching of Magnetic Multilayers for tunnel-magneto-resistance (TMR) sensors
Etching of Lithium Tantalate for infrared (IR) sensors
One system for all your processes: scia Cluster 200
Whether you want multiple chambers dedicated to one process or want to combine our wide process know how – we have the ideal cluster-layout for you!
- Ion Beam Trimming (IBT)
- (Reactive) Ion Beam Etching (RIBE)
- (Dual) Ion Beam Deposition (DIBD)
- Magnetron Sputtering (PVD)
- Reactive Ion Etching (RIE)
- Plasma Enhanced Chemical Vapor Deposition (PEVCD)
- Atomic Layer Deposition (ALD)
- Electron Beam Evaporation (EBE)
Selected systems for microelectronics production
Ask for your dedicated solution!
scia Systems GmbH
Clemens-Winkler-Str. 6c
09116 Chemnitz
Germany
