Ion Beam and Plasma Technology for Microelectronics Manufacturing: Coating, Etching, Trimming
Demand for modern electronics continues to grow as consumers look for higher performance, smaller dimensions and maximum reliability. scia Systems develops and builds ion beam and plasma process equipment for microelectronics manufacturing to meet these requirements.
Our ion beam etching, ion beam deposition, magnetron sputtering, and ion beam trimming systems enable precise thin-film deposition and etching processes for smart sensors and RF filters, as well as precise chip delayering for failure analysis and material inspection of integrated circuits (ICs). They are used in research and development as well as in high-volume production. Our equipment supports industry-standard wafers with 150 mm (6"), 200 mm (8"), and up to 300 mm (12") in diameter, and can be adapted to other substrates of different sizes.
We have installed over 530 systems for more than 250 customers worldwide in both research and industrial sectors. This extensive process expertise enables us to develop customized solutions for specific materials and throughput requirements.
scia Systems provides technologies and process equipment for various microelectronic applications:
Smart sensor technology
e.g., biotechnology sensors, lab-on-chip systems, GMR, TMR, IR sensors
High-frequency electronics
e.g., BAW, SAW
Cost-efficient power electronics
Advanced Silicon & beyond
- Failure Analysis for Advanced Electronics Packaging
e.g., multichip packages, SiPs, 3D packaging
MEMS Application Notes
Delayering for Failure Analysis of IC chip devices
Frequency Trimming of bulk acoustic wave (BAW) filters
Surface Trimming of surface acoustic wave (SAW) filters
Thickness Trimming of POI wafers for RF filters (SAW)
Film Thickness Correction of thin film read/write heads (TFH)
Temperature Compensation for surface acoustic wave wafers (TC-SAW)
SENSOR Application Notes
Deposition of GMR Sensors for flexible magnetoelectronics
Etching of Magnetic Multilayers for tunnel-magneto-resistance (TMR) sensors
Etching of Lithium Tantalate for infrared (IR) sensors
Selected systems for microelectronics production
Learn more
Ion Beam Technology – Enabling an Ever-Evolving Sensor Landscape
In this on-demand webinar, scia Systems’ Sales Director Marcel Demmler explains the principles and advantages of ion beam etching, ion beam deposition, and plasma processing, and how these technologies enable the reliable production of next-generation sensors.
Ion Beam and Plasma Technology for MEMS Production
Our technologies for thin film coating, dry etching and precision cleaning are essential for applications in smart sensors, high-frequency electronics, power electronics and advanced electronics packaging.
Technologies featured in the video:
- Improving RF-filter production by frequency trimming with scia Trim 200
- Ion beam processing of waveguides for Photonic Integrated Circuits (PIC)
- Structuring of micro-optics
- Failure analysis with precise layer-by-layer material removal
- Enhancing sensor technology with increased sensitivity & energy efficiency
- Structuring of TMR Sensors via ion beam etching
One system for all your processes: scia Cluster 200
Whether you want multiple chambers dedicated to one process or want to combine our wide process know how – we have the ideal cluster-layout for you!
- Ion Beam Trimming (IBT)
- (Reactive) Ion Beam Etching (RIBE)
- (Dual) Ion Beam Deposition (DIBD)
- Magnetron Sputtering (PVD)
- Reactive Ion Etching (RIE)
- Plasma Enhanced Chemical Vapor Deposition (PECVD)
- Atomic Layer Deposition (ALD)
- Electron Beam Evaporation (EBE)
Ask for your dedicated solution!
scia Systems GmbH
Clemens-Winkler-Str. 6c
09116 Chemnitz
Germany
Tel: +49 371 33561-0