Magnetron Sputtering
Magnetron sputtering uses a cathode with a permanent magnetic field to excite a dense plasma at the cathode surface. The target material, placed at the cathode surface, is physically sputtered by ion bombardment and gets deposited on the substrate surface. Thereby several process arrangements lead to different layer properties.
Sputtering with Single Magnetron
The process chamber contains one magnetron with rotating magnetic field with a target diameter larger than the substrate diameter. The arrangement allows thin films with high troughput.
Confocal Sputtering
The sputter arrangement consists of up to 4 Magnetrons, each with target diameter smaller than substrate diameter.The magnetrons can be combined for co-sputtering of alloys (different target materials) or for bipolar sputtering (same target materials).
Dynamic Sputter Deposition
The rotating substrate is moved linearly or orbitally over rectangular magnetrons to produce multilayer coatings. The individual emission profiles of the magnetrons are compensated by pre-calculation of the movement profiles, the layer thickness can be controlled by speed variation.
Systems for Dynamic Deposition
Multilayer coatings with up to 4 magnetrons on 300 mm wafers
- Magnetron Sputtering
(Dynamic deposition with 4 magnetrons, circular movement of the substrate)
Simultaneous coating of two substrates up to 680 mm dia.
- Magnetron Sputtering
(Dynamic deposition with 6 magnetrons, circular movement of the substrate)
Flexible multi-chamber coating system for substrates up to 1500 mm dia.
- Magnetron Sputtering
(Dynamic deposition with 4 magnetrons in each process module, linear movement)
Multilayer coatings for optical substrates
- Magnetron Sputtering
(Dynamic deposition with 6 magnetrons, linear movement of the substrate)
Static Deposition on Wafers
Advanced wafer coatings with high rates on wafers up to 200 mm
- Magnetron Sputtering
(Single-Magnetron Sputtering or Confocal Sputtering)
More Information
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