Advanced Ion Beam Thin Film Thickness Trimming for Photonic Integrated Circuit (PICs) Wafers

Photonic Integrated Circuits (PICs) represent a transformative technology that will revolutionize a wide range of industries, including telecommunications, computing, healthcare, and sensing. As the demand for faster, more efficient, and scalable technologies continues to grow, PICs are emerging as a key enabler of next-generation systems. Despite their numerous advantages, PICs face several difficulties. Developing suitable manufacturing processes for the mass production of PICs remains challenging.

Ion beam surface processing with nanometer and sub-nanometer precision is a powerful technology in the process chain for current and future electronic components. It enables the processing of a wide range of materials typical of PICs, including thin films with different optical properties, for various applications without exception.  

This application note demonstrates the application of ion beam technology for thickness trimming of Silicon Nitride (Si₃N₄) and Lithium Niobate (LiNbO₃) thin films.