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Participation on joint project – DANAE

Together with the project partners scia Systems is working on the development of thin film and matching technologies for nanoscale acousto-electronics. The objective of the collaboration is to establish the pre-conditions for depositing and trimming of materials needed in the acousto-electronic industry as well as the development of required components. The topic of scia Systems is: trimming technologies and the development of components for manufacturing of nanoscale acousto-electronic devices.