Polishing Error Correction for Lenses and Mirrors
The scia Finish 1500 is used for surface form error correction of high-precision optical elements. The system is suitable for high volume production with 24/7 operation due to fast pumping times and high removal rates of the ion beam source.
Features & Benefits
- Long term stable process for repeatable quality of optical components
- Excellent precision on large areas
- High removal rates for high throughput
- Easy loading of large substrates due to sliding doors
- Designed for high volume production with short down pumping times
Applications
- Final surface form error correction of lenses and mirrors
- Telescope mirrors (Zerodur®, SiC, LTEM)
- Conventional optics (quartz and other glasses)
- Ion beam figuring of X-ray optics (Si)
Application Note
- Form Error Correction for X-ray mirrors
Principle
- Focused broad ion beam scans across substrate surface in vertical setup for low contamination
- Dwell time control to remove different amounts of material
Technologies
Ion Beam Figuring (IBF) is a polishing error correction by a scanning ion beam and dwell time control.
Technical Data
Substrate size (up to) | 1500 mm dia., 400 kg |
Axis performance | Max. velocity 0.15 m/s, max. acceleration 15 m/s² |
Ion beam source | 37 mm circular RF source (RF37-i) with 7 ... 15 mm (FWHM) or |
Neutralizer | RF plasma bridge neutralizer (N-RF) |
Typical removal rate | SiO2: 14 mm3/h (RF37-i), 96 mm3/h (RF120-m) |
Thickness variation | < 0.5 nm RMS (dependent on input quality) |
Base pressure | < 1 x 10-6 mbar |
System dimensions | 3.60 m x 7.70 m x 3.40 m |
Configurations | Single chamber with sliding doors, manual loading with transport cart, 3, 4 or 5-axis control system for |
Software interfaces | SECS II / GEM, OPC |
Other Ion Beam Etching Systems
scia Trim 200
for precise surface correction
of wafers up to 200 mm
scia Mill 200
for full surface etching of
wafers up to 200 mm
