Full Surface Ion Beam Etching on 200 mm wafers

The scia Mill 200 is designed for structuring of complex multilayers of various materials. For an exact process control different end point detection systems can be equipped. With its fully reactive gas compatibility the system enables reactive etching processes with enhanced selectivity and rate. The flexible design of the scia Mill 200 allows to adapt it as single substrate version as well as in high volume production cluster layout with up to three process chambers and two cassette load-locks.

Features & Benefits

  • Etching angle adjustment with tiltable and rotatable substrate holder
  • Excellent uniformity without shaper
  • Enhanced selectivity and rate with reactive gases
  • Process control with exact SIMS based or optical end point detection
  • Processing of wafers with photoresist masks due to good wafer cooling
  • Fully automatic cassette handling in variable cluster layouts including SECS/GEM communication
Cluster layout with 3 process chambers and cassette handling
Cluster layout with 2 process chambers and cassette handling
Single chamber with single substrate load-lock

Applications

  • Structuring of magnetic memory (MRAM) and sensors (IR, GMR, TMR)
  • Milling of metals in MEMS production (Au, Ru, Ta, …)
  • Milling of multilayers from diversified metal and dielectric materials
  • RIBE or CAIBE of compound semiconductors (GaAs, GaN, InP, …)
  • Production of 3-dimensional optoelectronic microstructures
  • Ion beam smoothing for reduction of microroughness
  • Pattern transfer for optical gratings

Principle

Technical Data

Substrate size (up to)

200 mm dia.

Substrate holder

Water cooled, helium backside cooling contact, substrate rotation 5 to 20 rpm, tiltable in-situ from 0° to 175° in 0.1° steps

Ion beam source

350 mm circular RF source (RF350-e)

Neutralizer

RF plasma bridge neutralizer (N-RF)

Typical removal rates

Cu: 44 nm/min, Pt: 35 nm/min, W:17 nm/min, SiO2:20 nm/min

Uniformity variation

≤ 1 % (σ/mean)

Throughput

12 Wafer/h (100 nm SiO2 on 200 mm wafer)

Base pressure

< 5 x 10-7 mbar

System dimension (W x D x H)

3.20 m x 2.50 m x 2.50 m, for 3 chambers and cassette handling (without electrical racks and pumps)

Configurations

Single chamber, optional single substrate load-lock or cassette handling, Cluster system with up to 3 process chambers and cassette handling, optional OES or SIMS based end point detection

Software interfaces

SECS II / GEM, OPC

 

Other Ion Beam Etching Systems

scia Mill 150

for full surface etching of
substrates up to 150 mm

scia Trim 200

for precise surface correction
of wafers up to 200 mm

scia Finish 1500

for polishing error correction on
substrates up to 1500 mm