scia Coat 200 - Homogeneous multilayer coating on wafers
by Dual Ion Beam Deposition (DIBD)
The scia Coat 200 is designed for homogeneous coating of 200 mm substrates, such as wafers. Typical applications of the system are multilayer films for magnetic sensors or optical coatings.
The scia Coat 200 applies a beam from a focused broad beam ion source onto a sputter target. The beam of the assist ion source is directed to the substrate. By ion bombardment it is possible to control film characteristics or pre-clean the substrate.
If the system is equipped with a RF350‑e ion beam source as assist source, ion beam milling processes are also available on the same tool.
Up to 200 mm diameter; Carrier handling for multiple substrate sizes available
|Substrate holder||Water cooled, Helium backside cooling contact; Substrate rotation 5 to 20 rpm; Tiltable in‑situ from 0° to 170° in 0.1° steps|
Ion beam sources
Sputter source: RF120‑e
Plasma bridge neutralizer:
Target drum with 4 targets (tiltable),
Typical deposition rates
Al: 10 nm/min; Al2O3: 15 nm/min
≤ 1.5 %
≤ 5 x 10-7 mbar
|System dimensions (W x D x H)|
2.70 m x 1.70 m x 2.40 m
Single wafer load-lock; Cluster system with cassette handling
SECS II / GEM, OPC on request