High-Quality Cleaning and Qualification up to 800 mm in dia. and 500 mm in height
The scia Clean 800 is used for dry cleaning of 3-dimensional shaped substrates with weights up to 500 kg. The chamber design and functionality ensures a very good base pressure and allows to quantify even small residual contaminations on the substrate by mass spectroscopy measurement.
Features & Benefits
- Low base pressure and fast pumping due to electropolished and heated vacuum chamber
- Separate substrate heating for improved desorption
- Qualification of residual contamination by high-sensitive mass spectroscopy
- Optional plasma source for advanced cleaning with H2 plasma
- Recipes for repeatable temperature ramps and fully automated cleaning cycles
- Crane for loading of large and heavy substrates
Applications
- Ultra-high purity cleaning of X-ray optics
- Cleaning of components for beam line accelerators
- Outgassing qualification of complex vacuum assemblies
Principle
- Removing of contaminations from the 3-dimensional shaped substrates by using ultra-high vacuum (vacuum desorption)
- Further cleaning progress with optional heating of the substrate and/or chamber (thermal desorption) and applying plasma treatment
Technologies
Dry Cleaning allows the removal of substrate surface contaminations in vacuum with different methods. These methods can be applied successively to optimize the cleaning results.
Technical Data
Substrate size (up to) | 800 mm dia., 500 mm height, 500 kg |
Substrate heating | Radiation heaters (4.5 kW) up to 250 °C |
Chamber heating and cooling | Pressurized water based heating up to 150 °C and cooling (8 kW) |
Plasma sources | Optional ICP plasma source (PI400), max. 2.5 kW |
Base pressure | < 5 x 10-9 mbar |
Quality control | Mass spectrometer for quantitative outgassing measurement |
System dimension (W x D x H) | 1.30 m x 2.50 m x 1.40 m (without electrical rack and pumps) |
Configuration | Single chamber with top lid, optional crane for loading of heavy substrates |
Software interfaces | SECS II / GEM, OPC |
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