scia Clean 800 - High Quality Cleaning

by Dry Cleaning

scia Clean 800

The scia Clean 800 is designed for cleaning of 3‑dimensional shaped substrates by thermal desorption, vacuum desorption and plasma treatment. Typical applications are ultra-high purity cleaning of optical components and medical objects.

The scia Clean 800 is available with separate heating systems for the chamber and for the substrate. This ensures a very good base pressure, which is necessary to quantify even small residual contaminations on the substrate by mass-spectroscopy measurement. A crane can be used for loading of large and heavy substrates.

Technical Data

Substrate size

Up to 800 mm dia., 500 mm height, 500 kg

Plasma sources

Optional plasma source PI400

Max. RF power

2.5 kW for the source

Operating temperatures

Chamber: Heating up to 150°C and cooling
Substrate: Heating up to 250°C with radiation heating

Quality control

Mass spectrometer for quantitative outgassing measurement

Base Pressure

< 5 x 10-9 mbar

System dimensions (W x D x H)

1.30 m x 2.50 m x 1.40 m (without electrical rack and pumps)

Tool configuration

Single chamber with top lid, optional crane for loading of heavy substrates

Software interface

SECS II / GEM, OPC

Features

  • Separate heating of chamber and substrate
  • Optional plasma source for improved cleaning with H2 plasma
  • Crane for loading of large and heavy substrates
  • Controlling of cleaning quality with mass spectrometer

Applications

  • Ultra high purity cleaning of X-Ray optics
  • Sterilizing of medical objects
    (e.g. implants and stents)
  • Cleaning and degreasing metal surfaces of electric devices

Principle Dry Cleaning

Principle of Dry Cleaning by scia Clean 800

More Dry Cleaning Systems

scia Clean 1500
for cleaning of large 3D-substrates