Video presentation: Ion beam trimming of piezoelectric materials

Ion beam trimming is a special ion beam milling process, where a focused ion beam scans across the wafer. The local material removal is controlled by adjusting the dwell time. In his video presentation, our sales director Marcel Demmler introduces the ion beam trimming process and our process solution scia Trim 200, which can significantly improve the manufacturing yield of piezoelectric devices. He follows up by showing you two application examples including process results.

Here you can see the presentation.   

Please accept functional cookies to watch this video.

I accept.

Technology

 

Learn more about ion beam trimming and other ion beam processes in our technology overview.
 

Application

 

In our Application Note, we show you how ion beam trimming improves the surface homogeneity of POI wafers for RF filters.

Product

 

The scia Trim 200 is used for high precision surface trimming of wafers up to 200 mm, without limitations in film and wafer materials.

 

Do you want to speak to one of our experts? Contact us:

 

* mandatory field

scia Systems GmbH
Clemens-Winkler-Str. 6c
09116 Chemnitz
Germany

Tel: +49 371 33561-0

✉   sales@scia-systems.com

Additional Information

Overview of PVD Technologies

Comparison of ion beam sputtering, magnetron sputtering and evaporation.

Ion beam figuring for telescope mirrors

Video presentation: surface error correction under high vacuum conditions.

Slanted gratings by ion beam trimming

Video presentation: Processing with varying slant angles by reactive IBT