scia Coat 500 - High uniformity multilayer coatings on large area optics

by Dual Ion Beam Deposition (DIBD)

scia Coat 500

The scia Coat 500 is designed for homogeneous coating of high precision optics. Typical applications of the system are multilayer films for X-ray mirrors and filter coatings.

The scia Coat 500 applies a beam from a linear ion beam source onto a rectangular sputter target. This linear geometry provides a good homogeneity of the deposited film in one dimension. Meanwhile, the sample is moved on a linear axis in a direction perpendicular to the beam's profile, thereby contributing to homogeneity or defined gradients of the coating in the second dimension.

In addition the sample stage is equipped with a spin rotation and a changeable shaper system (up to 4  shapers) in front of the sample stage.

Technical Data

Substrate diameter

Up to 200 mm with load-lock
500 mm x 300 mm with manual loading

Ion Beam Source

Rectangular microwave ECR-source LIN380‑e


Plasma bridge neutralizer N‑DC

Target Holder

Target drum with 6 targets (tiltable), each with max. 400 mm x 200 mm

Typical deposition rate

Si: 10 nm/min

Axes performance

Linear from 0.01 mm/min up to 15 mm/min; Rotation up to 300 rpm

Uniformity deviation

≤ 0.5 % over 200 mm dia.
≤ 2 % over 500 mm x 300 mm

Base pressure

≤ 5 x 10-8 mbar

System dimensions (W x D x H)

3.30 m x 1.70 m x 2.10 m
(without electrical rack, pumps and load-lock)

Tool configurations

1 process chamber, 1 load-lock optional

Software interfaces

SECS II / GEM, OPC on request


  • Superposition of substrate rotation and linear movement
  • Aperture technique e.g. for lateral layer thickness distribution
  • Rectangular sputter and assist sources
  • Primary ion beam source with concave grid for focused linear ion profile on the target
  • Secondary ion beam source for pre-cleaning and assist during deposition
  • Up to 6 water cooled target materials on a rotational holder
  • Additional tilt of target surface
  • Very short coating times are precisely controllable e.g. for thin barrier layers


Principle Dual Ion Beam Deposition

Principle of Ion Beam Deposition by scia Coat 500

More Ion Beam Systems

scia Coat 200
for deposition on wafers
up to 200 mm
scia Mill 150
for etching of substrates
up to 150 mm
scia Mill 200
for etching of wafers
up to 200 mm
scia Trim 200
for focused trimming of wafers
up to 200 mm