Latest Company News

NEW APPLICATION NOTE: Ion Beam Etching for Reverse Engineering

As modern chip design pushes for smaller, more powerful and more compact devices, reverse engineering requires delayering with highest accuracy within the µm-, nm and atomic thickness range for different materials at once. Ion beam etching is capable to meet these strict requirements.

Learn more in our new application note.

 

Reverse Engineering

New Intro Video

With the increasing digitalization of conferences and exhibitions, we had to rethink and go a new way to present ourselves and our range of services.

You can see the result here: Our new video gives you a little insight into scia Systems in 30 seconds.

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Video

scia Systems starts into a year with big changes

We have an exciting year ahead of us, with many opportunities, but also challenges. The biggest challenge this year will probably be the move to our new location, starting in April.

We are very optimistic about the future and we wish all suppliers, customers and partners a successful, healthy and exciting 2021.

new building

Successful acceptance of scia Trim 200 in Singapore

Last year scia Systems won a public tender of a high precision film thickness trimmer tool for 200 mm wafer processing from the Institute of Microelectronics (IME) at the Agency for Science, Technology and Research (A*STAR) in Singapore.

We are happy that the scia Trim 200 was shipped, built up and installed despite the difficult conditions due to the pandemic. We like to thank our partner Nanyang Equipment Pte Ltd. for their great job and their support.

EUV developers from TRUMPF, ZEISS and Fraunhofer awarded for the "Deutscher Zukunftspreis" 2020

A team of ZEISS, Trumpf and Fraunhofer experts made a significant contribution to the development and industrial maturity of the EUV technology and has now been honored for this.

We congratulate our customer ZEISS together with Trumpf and Fraunhofer experts on being awarded for the “Deutscher Zukunftspreis” (German Future Prize) 2020 for their project » EUV Lithography - New Light for the Digital Age« .

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Sales Meeting 2020 went digital!

Unfortunately, the current situation did not allow us to meet with all our sales partners in person as we have done in the past years. Nevertheless, we wanted to stay in contact and share our latest developments and product achievements. Thankfully, we found a way to bring us all together!

A big THANK YOU to the whole team for your time and efforts!

If you would like to get in touch with one of our sales partners, you can find their contact information here: bit.ly/scia_worldwide

Spätschicht at scia Systems

On September 25th, during the “Spätschicht”-event (engl. late shift) organized by the Industriekultur Chemnitz, a total of 24 visitors were able to have a look at our clean rooms, talk to employees and get to know our systems. Our guests did not only gain a small insight into the exciting application options of ion beam and plasma technologies, ...

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Topping out ceremony for our new location

Last Friday we finally celebrated our topping-out ceremony together with OBAG. Despite distance rules it was a very nice celebration, where our employees and business partners could already get a first impression of our new location.

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scia Systems is going virtual for IEEE IFCS-ISAF 2020

The IEEE IFCS-ISAF 2020 Conference took place virtually this year. Although we couldn't join in person, we are still proud to support this event as Gold Patron and contribute a video of our sales director Marcel Demmler.

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scia Mill 150 for Imperial College London

scia Systems gladly announces the purchase of an ion beam milling system scia Mill 150 by Imperial College London – the world top ten university.

The scia Mill 150 will be located at the Michael Uren Biomedical Engineering Research Hub, specifically in the Sir Henry Royce Institute where world leading academics work closely together with industry on the commercialization of fundamental materials research. The Centre focusses on Atoms 2 Devices (A2D) research in functional materials and devices which are core components in key areas such as energy, communications and healthcare.

The scia Mill 150 will be used for top-down fabrication of devices and patterned structures. In conjunction with various lithography techniques available in the laboratory, the scia Mill 150 will be expected to enable a range of materials to be patterned on a micro-and nano-scale.