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The research project "System and process development for the atomic layer deposition of aluminum-based thin films for barriers, actuators, and electronics – MultiALD" is working on new methods to produce thin films based on trimethylaluminum (TMA) using atomic layer deposition (ALD).

To expand the high-quality research infrastructure at fem, scia Systems is equipping the institute with an expandable cluster system for manufacturing fuel cells, electrolysis, and battery electrodes on 200 mm substrates. The scia Cluster 200 consists of three process chambers, for pretreatment, sputtering, and coating.

Whole-wafer failure analysis (FA) solution for advanced packaging and increasing adoption of scia Mill 200 and scia Cluster 200 platforms underscore scia Systems’ leadership in ion beam and plasma processing.

We will showcase this innovative solution at SEMICON West 2025, taking place October 7-9 at the Phoenix Convention Center in Phoenix, Arizona.

The scia Cluster 200 system provides highly flexible and scalable ion beam and plasma processing for R&D and production environments. It uses multiple identical process chambers that can be combined to significantly increase throughput (up to 5X) or integrate different process technologies for sequential process steps on a single wafer without a vacuum break.

The scia Cluster 200 system can be configured individually according to the customer's application, allowing up to five process chambers and one or more load locks to be installed around the central transfer chamber.

In this on-demand webinar, scia Systems’ Sales Director Marcel Demmler explains the principles and advantages of ion beam etching, ion beam deposition, and plasma processing, and how these technologies enable the reliable production of next-generation sensors.

Learn how ion beam technology ensures accuracy, scalability, and reliability in the production of modern sensors.

Watch it

The scia Mill 200 system provides highly precise surface etching with enhanced selectivity. The system will be used for etching trenches and cleaning sidewalls of TSV (through-silicon via) wafers

Chemnitz, July 17, 2025 — Innovations in PICs are fundamental to the advancement of quantum technology and have the potential to change our increasingly data-driven world immensely. Megatrends such as the Internet of Things (IoT), 5G, and cloud computing are driving the exponential growth in data traffic. Innovative solutions that improve bandwidth, efficiency, and speed are, therefore, in demand. PICs are becoming increasingly important as they offer the ability to process and transmit data at optical speed while significantly reducing energy consumption compared to conventional electronic circuits.

One key processing technology for the production of PICs is ion beam etching. It enables the production of three-dimensional optoelectronic microstructures for PICs, such as waveguides and other optical components, with accuracies in the nanometer range.

Unlike electronic integrated circuits, PICs use photons (light particles) for data transmission and processing, paving the way for faster and more efficient technologies. However, the mass production of high-performance PICs remains challenging. One key factor? Material uniformity.

Our latest application note shows how ion beam trimming with scia Systems’ advanced solutions can reduce thickness standard deviation in silicon nitride films by a factor of ~16, paving the way for scalable, precise PIC manufacturing.

Want to learn more? Read the complete Application Note for free.

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From June 24 to 27, 2025, scia Systems will present its latest process solutions for coating and structuring based on advanced ion beam and plasma technologies at Laser World of Photonics 2025 in Munich, Germany. The focus will be on the coating and form error correction of X-ray optics, the structuring of optical gratings for AR glasses, and the creation of microstructures for photonic integrated circuits (PICs).