Last year scia Systems won a public tender of a high precision film thickness trimmer tool for 200 mm wafer processing from the Institute of Microelectronics (IME) at the Agency for Science, Technology and Research (A*STAR) in Singapore.
We are happy that the scia Trim 200 was shipped, built up and installed despite the difficult conditions due to the pandemic. We like to thank our partner Nanyang Equipment Pte Ltd. for their great job and their support.