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New Presentation: Reactive Ion Beam Etching of PIC Materials with High Optical Performance

Susanne Hartmann's presentation at the Photonics Spectra Integrated Photonics Summit 2026 discusses the typical challenges associated with ion beam etching and explains how our technology addresses sidewall effects such as footing, fencing, and trenching in thin-film lithium niobate (TFLN) processing, thereby enabling lower optical losses in photonic integrated circuits.

 

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