The scia Mill 200 enables high-precision structuring of magnetic multilayers with improved selectivity

Chemnitz, March 13, 2026 – scia Systems GmbH, the technology leader for high-precision, complex ion beam and plasma process equipment for the microelectronics, MEMS, and precision optics industries, announces that the Competence Centre Nano System Engineering at Kiel University (CAU) has ordered a scia Mill 200 ion beam etching system. The equipment will be used for precise structuring of magnetic stacks in the production of magnetoelectric sensors. The aim is to further improve the sensitivity, miniaturization, and integration capability of magnetoelectric sensors and to open up new fields of application.

Production of magnetoelectric sensors with the scia Mill 200

In order to improve the field detection limit of different sensor approaches, the competence center is researching various concepts to adapt the effective properties of magnetic multilayers. Ferromagnetic, antiferromagnetic, non-magnetic metallic, and insulating oxide layers with thicknesses ranging from a few nanometers to several micrometers are functionally linked with each other. A controlled and material-independent etching process of thick multilayer structures on large-area substrates requires a uniform etch rate without significant temperature increase and with precise endpoint detection, as provided by the scia Mill 200.

Efficient etching of several micrometers of layer thickness also requires a high etch rate. In addition, heat dissipation is also crucial for continuous etching without interruptions. Furthermore, the variability of the etch rate is important to etch ultra-thin layers in the nanometer range without damaging the underlying layer or substrate.

The ion beam etching system from scia Systems meets all these requirements. The scia Mill 200 enables reliable research work at the Competence Centre Nano System Engineering at Kiel University, even for future generations of researchers.

High-precision magnetic field sensors based on magnetic multilayer systems are used to detect any type of motion, including proximity, rotation, and vibration. GMR and TMR sensors are used in a wide range of industries and applications, including automotive electronics. Magnetoelectric sensors, based on magnetic multilayers that are often only a few micrometers thick, are a promising alternative concept for detecting extremely small magnetic fields. However, the complex, multi-layered structure of all these sensors creates significant challenges for conventional chemical and dry etching processes, as these methods struggle to process magnetic materials. 

Ion beam etching processes as used in the scia Mill 200 enable the selective ion beam patterning of these complex magnetic layer structures and offer significant advantages in terms of process stability, flexible adjustment of ion beam parameters, and precise control of etch rates.

The system layout is compatible with both inert gases (ion beam etching, IBE) and reactive gases (reactive ion beam etching, RIBE), including fluorine and chlorine gas chemistry. This enables the reliable patterning of complex magnetic stacks with high lateral resolution and controlled sidewall profiles. The exact endpoints of the etching processes for all materials are determined using the integrated secondary ion mass spectrometer (SIMS).

“We are very delighted about the collaboration with Kiel University. The decision to choose the scia Mill 200 highlights the performance capabilities of our ion beam technology for demanding research and development tasks in the field of magnetic sensor systems,” explains Dr. Michael Zeuner, Managing Director of scia Systems GmbH.

With the installation of the scia Mill 200, the University of Kiel is further expanding its expertise in thin-film technology and microsystems engineering. At the same time, scia Systems is strengthening its position as a provider of innovative equipment solutions for research institutions and the high-tech industry in surface and thin-film processing.

• For more information on the scia Mill 200 system, please visit www.scia-systems.com/scia-mill-200.
   
• Learn more about the technology of ion beam etching / ion beam milling.
   
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About scia Systems GmbH

Founded in 2013, scia Systems is a technology leader in thin-film process equipment based on advanced ion beam and plasma technologies. The systems are used for coating, etching, and cleaning processes with nanometer resolution and have been successfully implemented in various high-tech industries worldwide, including microelectronics, MEMS, and precision optics industries. For more information, visit the company’s website at www.scia-systems.com.
 

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scia Systems GmbH
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