The scia Trim 200 system provides precise surface correction in thin-film and wafer materials using ion beam trimming. Film thickness non-uniformity can be improved down to 0.1 nm.

Chemnitz, January 30, 2026 - scia Systems GmbH, the industry leader in advanced ion beam and plasma process equipment for microelectronics, MEMS, and precision optics industries, today announced that the Chinese high‑tech enterprise Shenzhen Microgate Technology has expanded its cleanroom with a scia Trim 200 system.

High Precision for the Production of Microelectronics on Wafers up to 200 mm

Shenzhen Microgate Technology manufactures components in which precise film thickness and surface uniformity directly determine electrical performance, including SAW (Surface Acoustic Wave) filters.

Especially for frequency filters used in mobile communications, frequency accuracy depends on nanometer-level control of film thickness. Even tiny deviations shift the filter’s center frequency and bandwidth.

scia Systems’ ion beam trimming technology can correct film thickness with sub-nanometer precision (~0.1 nm), which is exactly what these devices require. So, the scia Trim 200 enables a high component yield in the mass production of (TC) SAW filters.

High-Precision Surface Correction with scia Trim 200 

The scia Trim 200 ensures high-precision film-thickness trimming in wafer processing. Typical applications are frequency and thickness trimming in the manufacturing of acoustic-electrical devices and filters like bulk (BAW) or surface acoustic wave (SAW) filters, localized pole trimming of thin film head (TFH) applications, and trimming of precision thin-film resistors.

Designed for high-volume production, the system is equipped with a semiconductor cassette handling robot that accommodates standard wafer sizes up to 200 mm in diameter. The film trimming is performed by a focused broad ion beam with a sufficiently small focal spot. During trimming, the wafer gets moved in front of the ion source by an x-/y-stage.

A metrology system detects the exact frequency topography map for each wafer area and converts it into a coating thickness map. Based on that, the thickness of the coating that needs to be trimmed is calculated. Afterward, scia Systems’ internal control software calculates the corresponding dwell-time map and follows the velocity-scan profiles during the trimming process. Adapting the local dwell time of the ion beam at certain positions allows the control of the local removal and etch non-uniformities down to an impressive homogeneous film.

“We are confident that our ion beam technology will improve the customer’s production of electronic components. Our scia Trim 200 is designed specifically for processing these thin‑film structures, which are needed for SAW filters. Ion beam trimming allows Shenzhen Microgate Technology to bring borderline wafers back into spec instead of scrapping them.” stated Dr. Michael Zeuner, CEO of scia Systems.

• More information on the scia Trim 200 system is available at www.scia-systems.com/scia-trim-200.
   
• Further information about the production of frequency filters for mobile communication.
   
• Learn more about the technology of ion beam trimming.
   
• Do you have any questions? Our team will be happy to help you. Contact us!

About scia Systems GmbH

Founded in 2013, scia Systems is a technology leader in thin-film process equipment based on advanced ion beam and plasma technologies. The systems are used for coating, etching, and cleaning processes with nanometer resolution and have been successfully implemented in various high-tech industries worldwide, including microelectronics, MEMS, and precision optics industries. For more information, visit the company’s website at www.scia-systems.com.

Company Contact

Mandy Gebhardt
Head of Marketing
scia Systems GmbH
Tel: +49 371 33561 322
E-Mail: m.gebhardt@scia-systems.com