Unlike electronic integrated circuits, PICs use photons (light particles) for data transmission and processing, paving the way for faster and more efficient technologies. However, the mass production of high-performance PICs remains challenging. One key factor? Material uniformity.
Our latest application note shows how ion beam trimming with scia Systems’ advanced solutions can reduce thickness standard deviation in silicon nitride films by a factor of ~16, paving the way for scalable, precise PIC manufacturing.
Want to learn more? Read the complete Application Note for free.