scia Systems to present high-precision ion beam and plasma technologies for processing high-tech optics at Laser World of Photonics 2025

Chemnitz, June 02, 2025 — scia Systems GmbH, the industry leader in advanced ion beam and plasma process equipment for microelectronics, MEMS, and precision optics industries, will exhibit at Laser World of Photonics 2025. From June 24 to 27, 2025, the company will present its latest process solutions for coating and structuring based on advanced ion beam and plasma technologies at the New Fair in Munich, Germany. The focus will be on the coating and form error correction of X-ray optics, the structuring of optical gratings for AR glasses, and the creation of microstructures for photonic integrated circuits (PICs). 

Ion beam processing enables efficient and high-precision processing of photonic integrated circuits (PIC) 

Innovations in PICs are fundamental to the advancement of quantum technology and have the potential to change our increasingly data-driven world immensely. Megatrends such as the Internet of Things (IoT), 5G, and cloud computing are driving the exponential growth in data traffic. Innovative solutions that improve bandwidth, efficiency, and speed are, therefore, in demand. PICs are becoming increasingly important as they offer the ability to process and transmit data at optical speed while significantly reducing energy consumption compared to conventional electronic circuits.  

The photonic components contained in PICs, such as waveguides, lasers, modulators, and detectors, are designed to manipulate and transmit light signals. This enables fast data transmission and reduces signal loss over long distances.

One key processing technology for the production of PICs is ion beam etching. It enables the production of three-dimensional optoelectronic microstructures for PICs, such as waveguides and other optical components, with accuracies in the nanometer range.   
Ion beam trimming is also used to manufacture PICs efficiently. PICs consist of many active and passive optical layers. The respective layer thickness has a significant influence on the optical performance. Ion beam trimming is used to correct the layer thickness in the nanometer range. Among other things, this minimizes optical scattering and maintains phase coherence, which is crucial for the efficiency and stability of photonic components and ensures consistent and high-performance operation of the PIC component.

In addition, the surface of PIC devices can be polished using an ion beam. This improves micro-roughness, minimizes defects, and thus increases the yield and reliability of the PIC elements.   

scia Systems offers customized system solutions and manufacturing technologies for processing PICs. The scia Trim systems are ideally suited for correcting layer thicknesses and polishing optical surfaces, and the scia Mill systems are used for creating optical microstructures. Both system types are ideally suited for industrial volume production as well as research and development and are used by customers in the precision optics industry.