The Fraunhofer Institute for Reliability and Microintegration (IZM) has awarded scia Systems the contract for an ion beam etching system.
The equipment is funded by BMBF within „Forschungsfabrik Mikroelektronik Deutschland“ and it is primary intended for fabrication of metallic microstructures on semiconductor substrates. Depending on the metal to be etched and its position inside of a layer stack, the system uses inert gases, e.g. Argon, as well as reactive gases, or mixtures thereof.
We are pleased to deliver a scia Mill 300, designed for processing of 300 mm wafers, to Fraunhofer IZM. Core component of the system is a new developed ion beam source for those substrates sizes. With the further development of the existing product portfolio, scia Systems can better serve customer wishes for larger substrates.