Latest Company News

Successful development in research project HiPERFORM

With the substrate holder designed by scia Systems, epitaxial Aluminum Nitride (epi-AlN) can now be deposited on silicon (111). This is an important step for the development of GaN-based switch technologies. As these have up to 30% less energy losses compared to existing architectures, they can be used to produce more affordable and efficient electric and hybrid vehicles.

read more
HiPERFORM process chamber

scia Mill 300: Structuring of complex multilayers on 300 mm wafers

Increased wafer-size means lower costs. With our new system, scia Mill 300, you can benefit from all the advantages of ion beam etching on 300 mm wafers, such as excellent accuracy and uniformity, adjustable etch angle and processing of complex multilayers with inert and reactive gases.

Just like the other systems in the scia Mill-series, the scia Mill 300 has a full reactive gas compatibly, which enables reactive etch processes like reactive ion beam etching (RIBE) and chemically assisted ion beam etching (CAIBE).

Due to the flexible design, the system is suitable for high-volume and for small scale production.

read more
scia Mill 300

NEW APPLICATION NOTE: Ion Beam Etching for Reverse Engineering

As modern chip design pushes for smaller, more powerful and more compact devices, reverse engineering requires delayering with highest accuracy within the µm-, nm and atomic thickness range for different materials at once. Ion beam etching is capable to meet these strict requirements.

Learn more in our new application note.


Reverse Engineering

New Intro Video

With the increasing digitalization of conferences and exhibitions, we had to rethink and go a new way to present ourselves and our range of services.

You can see the result here: Our new video gives you a little insight into scia Systems in 30 seconds.

read more

scia Systems starts into a year with big changes

We have an exciting year ahead of us, with many opportunities, but also challenges. The biggest challenge this year will probably be the move to our new location, starting in April.

We are very optimistic about the future and we wish all suppliers, customers and partners a successful, healthy and exciting 2021.

new building

Successful acceptance of scia Trim 200 in Singapore

Last year scia Systems won a public tender of a high precision film thickness trimmer tool for 200 mm wafer processing from the Institute of Microelectronics (IME) at the Agency for Science, Technology and Research (A*STAR) in Singapore.

We are happy that the scia Trim 200 was shipped, built up and installed despite the difficult conditions due to the pandemic. We like to thank our partner Nanyang Equipment Pte Ltd. for their great job and their support.

EUV developers from TRUMPF, ZEISS and Fraunhofer awarded for the "Deutscher Zukunftspreis" 2020

A team of ZEISS, Trumpf and Fraunhofer experts made a significant contribution to the development and industrial maturity of the EUV technology and has now been honored for this.

We congratulate our customer ZEISS together with Trumpf and Fraunhofer experts on being awarded for the “Deutscher Zukunftspreis” (German Future Prize) 2020 for their project » EUV Lithography - New Light for the Digital Age« .

read more