Application Notes

The equipment of scia Systems is mainly used in the production of microelectronics and MEMS devices as well as for processing of precision optical components, but there are also applications in the biomedical sector. In the following, selected applications are presented in detail.


Frequency Trimming

of bulk acoustic wave (BAW) filters

Surface Trimming

of surface acoustic wave (SAW) filters

Thickness Trimming

of POI wafers for RF filters (SAW)

Film Thickness Correction

of thin film read/write heads (TFH)

Temperature Compensation

for surface acoustic wave wafers (TC-SAW)


Etching of Magnetic Multilayers

for tunnel-magneto-resistance (TMR) sensors

Etching of Lithium Tantalate

for infrared (IR) sensors


Dielectric Coatings

on large substrates

High- and Anti-Reflective Coatings

with Ta2O5 and SiO2

Form Error Correction

for X-ray mirrors

Deposition of DLC

for glas compression molds