scia Multi 300: multilayer coatings for wafers up to 300 mm dia. by magnetron sputtering
Expertise in Thin Film Technology
scia Systems provides precise surface processing equipment based on advanced ion beam and plasma technologies. The systems are applicable for coating, etching, and cleaning processes, especially for the MEMS, microelectronics, and precision optics industries. The process equipment is flexible and modular in design, thus can be easily configured for research applications and for high-volume production. It suits silicon wafer-based substrate sizes, smaller samples on carriers, and optical substrates with up to 3 m diameter.
Products
Discover our equipment for coating, etching and cleaning processes. The systems are flexible and modular in design. This enables us to offer standard as well as individual solutions for our customers all over the world.
Find your suitable system:
Applications
Our equipment is mainly used in the production of microelectronics, MEMS and precision optical components. However, there are also several applications in the field of astronomy, automotive and biomedical technology.
Explore our detailed application examples:
Company
scia Systems stands for highly reliable equipment to meet expectations for today and the future. Our experienced and qualified team assists you to find the optimal system and process design for your production requirement.
Get to know us:
Career
Do you want to play an active role in a high-tech and fast-growing market environment and build up a successful career? We are always looking for new team members who want to grow with us.