Expertise in Thin Film Technology

scia Systems provides precise surface processing equipment based on advanced ion beam and plasma technologies. The systems are applicable for coating, etching, and cleaning processes, especially for the MEMS, microelectronics, and precision optics industries. The process equipment is flexible and modular in design, thus can be easily configured for research applications and for high-volume production. It suits silicon wafer-based substrate sizes, smaller samples on carriers, and optical substrates with up to 3 m diameter.

Products

Our systems are flexible and modular in design. This enables us to offer standard as well as individual solutions for our customers all over the world.

Career

Do you want to play an active role in a high-tech and fast-growing market environment and build up a successful career? Discover our oppotunities:

 

 

Applications

Our equipment is mainly used in the production of MEMS and precision optical components, but it is also used in astronomy, automotive and biomedical technology.

Company

scia Systems stands for highly reliable equipment to meet expectations for today and the future. Our experienced and qualified team assists you to find the optimal system and process design for your production requirement.

Latest News

Ion Beam Trimming System for Silex Microsystems in China

Silex Microsystems, the world's largest pure-play MEMS foundry, is expanding its facility in Beijing, China. Recently, a scia Trim 200 was commissioned there, a high-volume production system for precise surface correction of wafers up to 200 mm.

The tool is used to produce filters by local ion beam trimming, which are needed for high frequency technology, for example in WLAN or mobile communication.

Besides this first system, which is now handed over to production, two other tools will be installed in Silex over the next months. We are looking forward to a successful partnership!

 

More News

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Upcoming Events

SPIE OPTICS + PHOTONICS

2022-08-23 to 2022-08-25
San Diego, United States
Booth: 626 (Floor Plan)

ICO & OWLS

2022-09-05 to 2022-09-09
Technische Universität Dresden
Dresden, Germany

PSE 2022

2022-09-13 to 2022-09-14
Erfurt, Germany
Presentation by Kevin Rettig: Modeling of the extraction of a focused ion beam from an inductively coupled plasma source (Details)

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