scia Systems provides precise surface processing equipment based on advanced ion beam and plasma technologies. The systems are applicable for coating, etching, and cleaning processes, especially for the MEMS, microelectronics, and precision optics industries. The process equipment is flexible and modular in design, thus can be easily configured for research applications and for high-volume production. It suits silicon wafer-based substrate sizes, smaller samples on carriers, and optical substrates with up to 3 m diameter.
scia Systems stands for highly reliable equipment to meet expectations for today and the future. Our experienced and qualified team assists you to find the optimal system and process design for your production requirement.
2022-09-05 to 2022-09-09
Technische Universität Dresden