Expertise in Thin Film Technology

scia Systems provides precise surface processing equipment based on advanced ion beam and plasma technologies. The systems are applicable for coating, etching, and cleaning processes, especially for the MEMS, microelectronics, and precision optics industries. The process equipment is flexible and modular in design, thus can be easily configured for research applications and for high-volume production. It suits silicon wafer-based substrate sizes, smaller samples on carriers, and optical substrates with up to 3 m diameter.

Products

Our systems are flexible and modular in design. This enables us to offer standard as well as individual solutions for our customers.

Applications

Our equipment is mainly used in the production of MEMS and precision optical components, but also in astronomy and biomedical technology.

Company

Pushing the latest technologies with ambition and constantly evolving - that's what scia Systems is all about.

Latest News

Unlike electronic integrated circuits, PICs use photons (light particles) for data transmission and processing, paving the way for faster and more efficient technologies. However, the mass production of high-performance PICs remains challenging. One key factor? Material uniformity.

Our latest application note shows how ion beam trimming with scia Systems’ advanced solutions can reduce thickness standard deviation in silicon nitride films by a factor of ~16, paving the way for scalable, precise PIC manufacturing.

Want to learn more? Read the complete Application Note for free.