scia Magna 200 - High uniformity at high deposition rates

by Magnetron Sputtering

scia Magna 200

The scia Magna 200 uses a unique Double Ring Magnetron architecture to achieve very high homogeneity of coatings at impressively high deposition rates. Typical applications include piezoelectric layers, optical coatings and passivation layers.

The system is available with either a single wafer load-lock or an automatic handling robot in a cluster configuration. Its advanced substrate holder features simultaneous rotation, helium cooling and RF bias.

The special DRM 400 sputter source from Fraunhofer FEP has individually controllable plasma discharges from the concentric inner and outer target rings, enabling layer thickness variation of less than ± 0.5 % (over 200 mm). At the same time, very high deposition rates in reactive sputter mode can be achieved. Due to its integrated control mechanisms, long term stability of processing is ensured.

Technical Data

Substrate diameterUp to 200 mm

Substrate holder

Water cooled, up to 20 rpm rotation, helium backside cooling contact, RF bias

Sputter source

Double Ring Magnetron DRM 400 from Fraunhofer FEP

Sputter modes

DC, RF, uni- and bipolar pulse mode

Typical deposition rates

SiO2: 5 nm/s, Al2O3: 3 nm/s,
Metals: 15 … 25 nm/s

Uniformity variation

≤ 0.5 %

Base pressure

< 1 x 10-6 mbar

System dimensions (W x D x H)

1.20 m x 2.00 m x 2.20 m (without electrical rack and pumps)

Tool configurations

Single wafer load-lock, cassette handling, cluster system

Software interfaces

SECS II / GEM, OPC

Features

  • Double Ring Magnetron (DRM 400) source with DC, uni- and bipolar pulse modes
  • High deposition rates
    (SiO2:5 nm/s; Al2O3: 3 nm/s)
  • Film thickness variation of less than ± 0.5 % over 200 mm wafers
  • Precise regulation of reactive processes for high deposition rates and long term stability
  • Automatic magnet adjustment to compensate for sputter target erosion
  • Cluster layout available

Applications

  • Temperature compensation films for SAW devices (SiO2)
  • Piezoelectric films with excellent
    crystalline orientation (AlN)
  • Optical coatings
    (Si3N4, SiO2, HfO2, Ta2O5, Al2O3)
  • Electrical insulating films
    (Si3N4, SiO2, Al2O3)

Principle Magnetron Sputtering

Principle of Magnetron Sputter Deposition by scia Magna 200

More Magnetron Sputtering Systems

scia Multi 680
for Multilayer Deposition on optical substrates