scia Clean 1500 - Cleaning of large 3D-substrates

by Plasma Cleaning

scia Clean 1500

The scia Clean 1500 is designed for cleaning of large 3‑dimensional shaped substrates by thermal desorption, vacuum desorption and plasma treatment. Typical applications are ultra-high purity cleaning of optical components and medical objects.

The scia Clean 1500 is available with separate heating systems for the chamber and for the substrate. This ensures a very good base pressure, which is necessary to quantify even small residual contaminations on the substrate by mass-spectroscopy measurement. The cleaning is improved by a selectable quantity of plasma sources according to customer requirements. The transfer system can be used for substrates weighing up to 3 tons.

Technical Data

Chamber size

2.00 m x 3.00 m x 2.00 m

Plasma sources

Optional plasma sources PI400

Max. RF power

2.5 kW for each source

Operating temperatures

Chamber: Cooling down to 0°C; heating up to 150°C Substrate: Heating up to 250°C with radiation heating

Quality control

Mass spectrometer for cleaning level measurement

Base Pressure

< 5 x 10-8 mbar

System dimensions (W x D x H)

9.00 m x 6.00 m x 4.00 m (with electrical rack and pumps)

Tool configuration

Transfer system with transport wagon for the substrate Selectable quantity of plasma sources, turbo or cryo pump

Software interface

SECS II / GEM

Features

  • Separate heating of chamber and substrate
  • Selectable quantity of plasma sources
  • Transfer system for loading of large 3D-substrates
  • Controlling of cleaning quality with mass spectrometer

Applications

  • Ultra high purity cleaning of X-Ray optics
  • Sterilizing of medical objects
    (e.g. implants and stents)
  • Cleaning and degreasing metal surfaces of electric devices

Principle Plasma Cleaning

Principle of Plasma Cleaning by scia Clean 1500